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BZB100A
Dual back-to-back Zener diode
Rev. 01 -- 28 January 2008 Product data sheet
1. Product profile
1.1 General description
Dual back-to-back Zener diode in a SOD323 (SC-76) very small Surface-Mounted Device (SMD) plastic package.
1.2 Features
I I I I Non-repetitive peak reverse power dissipation: 30 W Dual back-to-back configuration Small plastic package suitable for surface-mounted design AEC-Q101 qualified
1.3 Applications
I General regulation functions I Overvoltage protection for ElectroLuminescent (EL) driver circuits
1.4 Quick reference data
Table 1. Symbol Per device VZ IZSM
[1]
Quick reference data Parameter working voltage non-repetitive peak reverse current Conditions IZ = 1 mA
[1]
Min 95 -
Typ -
Max 105 0.23
Unit V A
tp = 100 s; square wave; Tj = 25 C prior to surge
2. Pinning information
Table 2. Pin 1 2 Pinning Description anode (diode 1) anode (diode 2)
1 2 1 2
006aab041
Simplified outline
Symbol
NXP Semiconductors
BZB100A
Dual back-to-back Zener diode
3. Ordering information
Table 3. Ordering information Package Name BZB100A SC-76 Description plastic surface-mounted package; 2 leads Version SOD323 Type number
4. Marking
Table 4. BZB100A Marking codes Marking code AT Type number
5. Limiting values
Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per device IZSM PZSM Ptot non-repetitive peak reverse current non-repetitive peak reverse power dissipation total power dissipation Tamb 25 C
[1]
Parameter
Conditions
Min -55 -65
Max 0.23 30 75 300 540 830 150 +150 +150
Unit A W W mW mW mW C C C
[1] [2] [3] [4] [5]
Tj Tamb Tstg
[1] [2] [3] [4] [5]
junction temperature ambient temperature storage temperature
tp = 100 s; square wave; Tj = 25 C prior to surge tp = 10 s; square wave; Tj = 25 C prior to surge
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for anode 1 cm2. Device mounted on a ceramic PCB, Al2O3, standard footprint.
BZB100A_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 28 January 2008
2 of 10
NXP Semiconductors
BZB100A
Dual back-to-back Zener diode
1.0 Ptot (W) 0.8
(1)
006aab042
0.6
(2)
0.4
(3)
0.2
0 -75
-25
25
75
125 175 Tamb (C)
(1) Ceramic PCB, Al2O3, standard footprint (2) FR4 PCB, mounting pad for anode 1 cm2 (3) FR4 PCB, standard footprint
Fig 1. Power derating curves
6. Thermal characteristics
Table 6. Symbol Per device Rth(j-a) thermal resistance from junction to ambient in free air
[1] [2] [3]
Thermal characteristics Parameter Conditions Min Typ Max 415 230 150 90 Unit K/W K/W K/W K/W
Rth(j-sp)
[1] [2] [3] [4]
thermal resistance from junction to solder point
[4]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for anode 1 cm2. Device mounted on a ceramic PCB, Al2O3, standard footprint. Soldering point of anode.
BZB100A_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 28 January 2008
3 of 10
NXP Semiconductors
BZB100A
Dual back-to-back Zener diode
7. Characteristics
Table 7. Characteristics Tj = 25 C unless otherwise specified. Symbol Per device VZ rdif IR SZ Cd working voltage differential resistance reverse current temperature coefficient diode capacitance IZ = 1 mA IZ = 1 mA VR = 76 V IZ = 1 mA f = 1 MHz; VR = 0 V 95 123 105 700 0.05 10 V A mV/K pF Parameter Conditions Min Typ Max Unit
103 PZSM (W) 102
006aab043
150 SZ (mV/K) 140
006aab044
130
120 10 110
1 10-5
10-4
10-3 tp (s)
10-2
100 0 1 2 3 4 IZ (mA) 5
Tj = 25 C (prior to surge)
Tj = 25 C to 150 C
Fig 2. Non-repetitive peak reverse power dissipation as a function of pulse duration; maximum values
Fig 3. Temperature coefficient as a function of working current; typical values
BZB100A_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 28 January 2008
4 of 10
NXP Semiconductors
BZB100A
Dual back-to-back Zener diode
10-2 IZ (A) 10-3 10-4 10-5 10-6 10-7 10-8 10-9 80 90 100 110
006aab045
120 VZ (V)
Tj = 25 C
Fig 4. Working current as a function of working voltage; typical values
8. Application information
High-voltage Zener diodes can be used as overvoltage protection diodes for Integrated Circuits (IC) due to their ability to cut off the applied voltage at a well-defined value. One important application is the protection of EL driver circuits where a driver IC is connected to an EL foil. Since both the foil as well as the IC are sensitive against voltage overstress, it is necessary to install an additional protection device in the circuit. Commonly, a peak-to-peak voltage of 220 V should not be exceeded, such that two 100 V diodes in back-to-back configuration are used.
CHF CLF
CHF CLF E n.c. GND
1 2 3 4 5 DRIVER IC
10 9 8 7 6
V+ L+ VO L- n.c.
VBAT
Renable
ENABLE
L
BZB100A
EL LAMP
006aab046
Fig 5. Application diagram
BZB100A_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 28 January 2008
5 of 10
NXP Semiconductors
BZB100A
Dual back-to-back Zener diode
9. Test information
9.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications.
10. Package outline
1.35 1.15 1 0.45 0.15 1.1 0.8
2.7 2.3
1.8 1.6
2 0.40 0.25 Dimensions in mm 0.25 0.10 03-12-17
Fig 6. Package outline SOD323 (SC-76)
11. Packing information
Table 8. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number BZB100A
[1]
Package SOD323
Description 4 mm pitch, 8 mm tape and reel
Packing quantity 3000 -115 10000 -135
For further information and the availability of packing methods, see Section 15.
BZB100A_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 28 January 2008
6 of 10
NXP Semiconductors
BZB100A
Dual back-to-back Zener diode
12. Soldering
3.05 2.80 2.10 1.60
solder lands solder resist
1.65
0.95
0.50
0.60 occupied area solder paste
0.50 (2x)
msa433
Dimensions in mm
Fig 7. Reflow soldering footprint SOD323 (SC-76)
5.00 4.40 1.40 solder lands solder resist occupied area 2.75 1.20
msa415
preferred transport direction during soldering
Dimensions in mm
Fig 8. Wave soldering footprint SOD323 (SC-76)
BZB100A_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 28 January 2008
7 of 10
NXP Semiconductors
BZB100A
Dual back-to-back Zener diode
13. Revision history
Table 9. Revision history Release date 20080128 Data sheet status Product data sheet Change notice Supersedes Document ID BZB100A_1
BZB100A_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 28 January 2008
8 of 10
NXP Semiconductors
BZB100A
Dual back-to-back Zener diode
14. Legal information
14.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
14.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
14.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or
14.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
15. Contact information
For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: salesaddresses@nxp.com
BZB100A_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 28 January 2008
9 of 10
NXP Semiconductors
BZB100A
Dual back-to-back Zener diode
16. Contents
1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 9.1 10 11 12 13 14 14.1 14.2 14.3 14.4 15 16 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Thermal characteristics. . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Application information. . . . . . . . . . . . . . . . . . . 5 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 6 Quality information . . . . . . . . . . . . . . . . . . . . . . 6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 Packing information. . . . . . . . . . . . . . . . . . . . . . 6 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Contact information. . . . . . . . . . . . . . . . . . . . . . 9 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 28 January 2008 Document identifier: BZB100A_1

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